Electronics Assembly Hot Melt Adhesive

Precision hot melt adhesive for electronic component bonding wire tacking and PCB assembly. Features low viscosity for precise dispensing flame retardant options (UL94 V-0 rated) and excellent electrical insulation properties. Designed for wire and cable tacking coil winding sensor potting connector strain relief and battery pack assembly. Compatible with precision jet dispensing and needle dispensing equipment. Provides excellent dielectric properties and thermal cycling resistance.
Base Material
EVA / Polyolefin (Electronics Grade) Form: Granules / Sticks Color: Clear / Black Application Temp: 160-180°C Viscosity (180°C): 1,000-5,000 mPa·s (low viscosity) Volume Resistivity: > 1×10¹⁴ Ω·cm Dielectric Strength: > 15 kV/mm Flame Retardant: UL94 V-0 (optional) Thermal Cycling: -40°C to +85°C Packaging: 25kg/bag or 1kg sticks Shelf Life: 18 months Certification: ROHS, REACH

Full Specifications

Base MaterialEVA / Polyolefin (Electronics Grade) Form: Granules / Sticks Color: Clear / Black Application Temp: 160-180°C Viscosity (180°C): 1,000-5,000 mPa·s (low viscosity) Volume Resistivity: > 1×10¹⁴ Ω·cm Dielectric Strength: > 15 kV/mm Flame Retardant: UL94 V-0 (optional) Thermal Cycling: -40°C to +85°C Packaging: 25kg/bag or 1kg sticks Shelf Life: 18 months Certification: ROHS, REACH

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